Lucintel Forecasts the Global Advanced IC Packaging Market to Reach$52.3 billion by 2027
Lucintel Forecasts the Global Advanced IC Packaging Market to Reach$52.3 billion by 2027
Blog Article
According to a market report by Lucintel, the future of the global advanced IC packaging market looks promising with opportunities in the consumer & communication, automotive, industrial, healthcare, and aerospace & defense industries. The global advanced IC packaging market is expected to reach an estimated $52.3 billion by 2027 from $37.6 billion in 2024,at a CAGR of 5.7% from 2024 to 2030. The major drivers for this market are growing semiconductor industry, increasing miniaturization of electronic devices, demand for higher speed and smaller pitch size, and increasing penetration of 2.5D/3D packaging technology.
A more than 150-page report to understand trends, opportunity and forecast in advanced IC packaging market to 2030 by packaging type (flip-chip, fan-in wafer level packaging, embedded-die, fan-out, 2.5D/3D) end use industry (consumer and communication, automotive, industrial, healthcare, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that flip-chip will remain the largest segment due to rise in demand for high speed portable devices and high packaging density.
Consumer and communication will remain the largest end-use industry during the forecast period. Increasing demand for smartphones, connected and high performance consumer devices with AI technology, and demand for high performance computing are driving the demand for advanced IC packaging in the consumer and communication market.
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Asia Pacific will remain the largest region over the forecast period due to the presence of large foundries and manufacturing hub for electronic devices. Economic growth, growing urbanization, growing disposable income, and increasing adoption of digital technologies, such as 5G, Internet of things (IoT), and artificial intelligence (AI) are driving the demand for advanced IC packaging market
Amkor Technology, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel Corporation, Samsung Electronics, JCET Group, Texas Instruments, Toshiba Corporation, Renesasare the major suppliers in the advanced IC packaging market.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or write us at helpdesk@lucintel.comTo get access of more than 1000 reports at fraction of cost visit Lucintel'sAnalytics Dashboard.
About Lucintel
At Lucintel, we offer solutions for you growth through game changer ideas and robust market &unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. +1-972-636-5056
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